JPH0641726Y2 - 電子部品半田付装置 - Google Patents

電子部品半田付装置

Info

Publication number
JPH0641726Y2
JPH0641726Y2 JP1988061619U JP6161988U JPH0641726Y2 JP H0641726 Y2 JPH0641726 Y2 JP H0641726Y2 JP 1988061619 U JP1988061619 U JP 1988061619U JP 6161988 U JP6161988 U JP 6161988U JP H0641726 Y2 JPH0641726 Y2 JP H0641726Y2
Authority
JP
Japan
Prior art keywords
electronic component
soldering
pressing
lead terminals
pair
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1988061619U
Other languages
English (en)
Japanese (ja)
Other versions
JPH01165167U (en]
Inventor
勝己 田渕
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Ten Ltd
Original Assignee
Denso Ten Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Ten Ltd filed Critical Denso Ten Ltd
Priority to JP1988061619U priority Critical patent/JPH0641726Y2/ja
Publication of JPH01165167U publication Critical patent/JPH01165167U/ja
Application granted granted Critical
Publication of JPH0641726Y2 publication Critical patent/JPH0641726Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP1988061619U 1988-05-12 1988-05-12 電子部品半田付装置 Expired - Lifetime JPH0641726Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988061619U JPH0641726Y2 (ja) 1988-05-12 1988-05-12 電子部品半田付装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988061619U JPH0641726Y2 (ja) 1988-05-12 1988-05-12 電子部品半田付装置

Publications (2)

Publication Number Publication Date
JPH01165167U JPH01165167U (en]) 1989-11-17
JPH0641726Y2 true JPH0641726Y2 (ja) 1994-11-02

Family

ID=31287277

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988061619U Expired - Lifetime JPH0641726Y2 (ja) 1988-05-12 1988-05-12 電子部品半田付装置

Country Status (1)

Country Link
JP (1) JPH0641726Y2 (en])

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6052099A (ja) * 1983-08-31 1985-03-23 日本電気ホームエレクトロニクス株式会社 部品の自動実装装置
JPS6352762A (ja) * 1986-04-09 1988-03-05 Apollo Seiko Kk 整列端子部の半田付け方法及びその自動半田付け装置

Also Published As

Publication number Publication date
JPH01165167U (en]) 1989-11-17

Similar Documents

Publication Publication Date Title
US4952529A (en) Method of coupling a terminal to a thick film circuit board
KR20090047479A (ko) 전자 부품 실장 장치 및 전자 부품 실장 방법
JPH11260521A (ja) 電気コネクタ
US3474521A (en) Bonding method
JPH0641726Y2 (ja) 電子部品半田付装置
JPH02169178A (ja) ヒータ棒装置
US5051555A (en) Hot-bar suspension system
US6369345B1 (en) Method and apparatus for reflowing solder paste using a light source
JP2555720B2 (ja) 半田バンプ部品の実装方法
JP2510688B2 (ja) 過剰はんだ除去装置
JPH054315Y2 (en])
JP2817867B2 (ja) 電線布線装置
KR100295867B1 (ko) 플럭스공급스크린의완충장치
JPS62101097A (ja) 高周波素子の実装方法
JPH04314389A (ja) 電子部品の半田付け方法
US20240381542A1 (en) Method for aligning contact surfaces of an electrical and/or electronic component, in particular of a magnetic component
JPS61208291A (ja) 面実装型lsiの半田付け装置
JPS5837991A (ja) フラツトパツケ−ジ形電子部品の実装装置
JP2628935B2 (ja) 半同軸誘電体共振子の固定方法
JPH05347473A (ja) 配線基板
JP2001119133A (ja) ソルダペースト印刷装置、ソルダペースト印刷方法、配線基板及び電気機器の製造方法
JPS6239100A (ja) 電子部品の実装装置
JP2681702B2 (ja) 面実装部品の実装方法
JPH0797595B2 (ja) 半導体部品の実装方法
JPH0222141Y2 (en])