JPH0641726Y2 - 電子部品半田付装置 - Google Patents
電子部品半田付装置Info
- Publication number
- JPH0641726Y2 JPH0641726Y2 JP1988061619U JP6161988U JPH0641726Y2 JP H0641726 Y2 JPH0641726 Y2 JP H0641726Y2 JP 1988061619 U JP1988061619 U JP 1988061619U JP 6161988 U JP6161988 U JP 6161988U JP H0641726 Y2 JPH0641726 Y2 JP H0641726Y2
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- soldering
- pressing
- lead terminals
- pair
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000005476 soldering Methods 0.000 title claims description 56
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 49
- 239000000758 substrate Substances 0.000 claims description 25
- 229910052742 iron Inorganic materials 0.000 claims description 14
- 229910000679 solder Inorganic materials 0.000 description 14
- 238000010438 heat treatment Methods 0.000 description 6
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 235000000396 iron Nutrition 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988061619U JPH0641726Y2 (ja) | 1988-05-12 | 1988-05-12 | 電子部品半田付装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988061619U JPH0641726Y2 (ja) | 1988-05-12 | 1988-05-12 | 電子部品半田付装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01165167U JPH01165167U (en]) | 1989-11-17 |
JPH0641726Y2 true JPH0641726Y2 (ja) | 1994-11-02 |
Family
ID=31287277
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1988061619U Expired - Lifetime JPH0641726Y2 (ja) | 1988-05-12 | 1988-05-12 | 電子部品半田付装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0641726Y2 (en]) |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6052099A (ja) * | 1983-08-31 | 1985-03-23 | 日本電気ホームエレクトロニクス株式会社 | 部品の自動実装装置 |
JPS6352762A (ja) * | 1986-04-09 | 1988-03-05 | Apollo Seiko Kk | 整列端子部の半田付け方法及びその自動半田付け装置 |
-
1988
- 1988-05-12 JP JP1988061619U patent/JPH0641726Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH01165167U (en]) | 1989-11-17 |
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